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Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series) de Incropera

Descripción - Reseña del editor Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems. Biografía del autor Frank P. Incropera is an American mechanical engineer and author on the subjects of mass and heat transfer. Incropera is the Clifford and Evelyn Brosey Professor of Mechanical Engineering at the University of Notre Dame, Indiana, US.

Detalles del Libro

  • Name: Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series)
  • Autor: Incropera
  • Categoria: Libros,Ciencias, tecnología y medicina,Tecnología e ingeniería
  • Tamaño del archivo: 9 MB
  • Tipos de archivo: PDF Document
  • Idioma: Español
  • Archivos de estado: AVAILABLE


Descargar Liquid Cooling (Thermal Management of Microelectronic and Electronic System Series) de Incropera libros ebooks

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Liquid Cooling Technology - Mentor Graphics ~ Liquid Cooling Technology Leveraging FloTHERM to design a Compact Liquid Cooling System for High Power Microelectronic Devices. By Gongyue Tang,Yong Han, Boon Long Lau, Xiaowu Zhang, and Daniel Min Woo Rhee, Institute of Microelectronics, Agency for Science, Technology and Research, Singapore

Thermal Management of Microelectronic Equipment - ASME ~ In the cooling of electronic equipment, liquid cooling is frequently applied to high—heat dissipation electronic equipment. The reason is that the liquid has better heat transfer properties than that of the gas. Liquid cooling can further be divided into single- and two-phase systems.

Electronics Cooling: Thermal Management Approaches and Principles - ATS Webinar Series ~ A leading-edge engineering and manufacturing company focused on the thermal management of electronics. Service, Products and Training • Cooling Solutions – From Chip to System

An Overview of Liquid Coolants for Electronics Cooling ~ In the future, coolants with better properties (thermal conductivity, specific heat, thermal stability) may be available, but their popularity will depend on their reliability and economics. References. Incropera, F., Liquid Cooling of Electronic Devices by Single-Phase Convection, New York: John Wiley & Sons, 1999, pp. 1-14.

Liquid cooling fundamentals for high - Electronic Products ~ Designing a liquid cooling solution for a TV transmitter module or any other type of heat-producing electronic device is a fairly straightforward exercise with one exception: Liquid cooling brings non-dielectric coolants into proximity with electrical components — where any leak, no matter how small, is likely to have dire consequences.

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Cooling of Electronic Systems / SpringerLink ~ The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of .

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Thermal management (electronics) - Wikipedia ~ All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure.The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and .

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Thermal management of high power dissipation electronic ~ Abstract: Performance-driven electronic packaging demands for thermal solutions of high power dissipation such as enhanced air cooling or, alternatively, liquid cooling technologies. This paper reports the characterization of air-cooled vapor chamber heat sink (VCHS) and liquid cooled heat sinks (LCHS) for electronic packages with a targeted power dissipation of 140W.

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COOLING MICROELECTRONIC DEVICES USING OPTIMAL MICROCHANNEL ~ Cooling Microelectronic Devices Using Otimal Microcannel Heat Sins Rev.IA.sc.Ing.Antioq / scuela de Ingeniera de Antioquia objetivo se obtuvo con el criterio de la mínima generación de entropía. En este estudio, se definió la geometría del microcanal, la cantidad de calor a ser retirado y las propiedades del fluido de trabajo.